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pubblicato da
Springer International Publishing
Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems*, Volume 6 of the* Proceedings of the 2019 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the sixth volume of six from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:
Test Design and Inverse Method Algorithms
Inverse Problems: Virtual Fields Method
Residual Stresses: Measurement, Uncertainty & Validation
Residual Stresses: Eigenvalues, Modeling, & Crack Growth
Material Characterizations Using Thermography
Fatigue, Damage & Fracture Evaluation Using Infrared Thermography
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