Carta PAYBACK di Mondadori
Su Mondadori Store, con la tua carta PAYBACK ti premi ad ogni acquisto.
pubblicato da
Springer International Publishing
Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems*, Volume 7 of the* Proceedings of the 2020 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the seventh volume of sseven from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:
Test Design and Inverse Method Algorithms
Inverse Problems: Virtual Fields Method
Residual Stresses: Measurement, Uncertainty & Validation
Residual Stresses: Eigenvalues, Modeling, & Crack Growth
Material Characterizations Using Thermography
Fatigue, Damage & Fracture Evaluation Using Infrared Thermography
Scrivi una recensione per "Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, Volume 7"
Torna in cima
dai un voto
